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FGM840R Wi-Fi 4 & Bluetooth MCU Module with Dual-Core Cortex-M33/M23 Processor | Quectel

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FGM840R Wi-Fi 4 & Bluetooth MCU Module with Dual-Core Cortex-M33/M23 Processor | Quectel

Model Number : FGM840R

Price : Negotiation

Packaging Details : New original box

Place of Origin : OEM

MOQ : 1

Brand Name : Quectel

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FGM840R Wi-Fi 4 & Bluetooth MCU Module with Dual-Core Cortex-M33/M23 Processor
Product Overview

The Quectel FGM840R is a cutting-edge MCU Wi-Fi 4 and Bluetooth combo module featuring a dual-core processor architecture with Cortex-M33 and Cortex-M23 cores, delivering advanced wireless connectivity and embedded computing capabilities for next-generation IoT applications.

Key Features
  • Wi-Fi 4 module supporting 2.4 GHz and 5 GHz Wi-Fi bands with 1×1 antenna configuration
  • Supports BLE 5.4 and Wi-Fi pairing via Bluetooth
  • Built-in 512 KB SRAM and 4 MB flash memory
  • IEEE 802.11 a/b/g/n protocol support
  • QuecOpen® solution supports up to 20 GPIOs for multiple interfaces
  • RF coaxial connector or pin-type antenna interface (optional)
  • Wide operating temperature range: -40 °C to +85 °C
  • USB-to-Ethernet solution capability
Technical Specifications
Processor Dual-core Cortex-M33/M23, up to 200 MHz
Memory 512 KB SRAM, 4 MB flash memory
Wireless Protocols IEEE 802.11 a/b/g/n, Bluetooth 5.4
Frequency Bands 2.4 GHz and 5 GHz Wi-Fi
Package Dimensions 12.5 mm × 13.2 mm × 2.05 mm (LGA)
Operating Temperature -40 °C to +85 °C
Security Features WPA-PSK, WPA2-PSK, WPA3-SAE, TRNG, AES-128, TrustZone, Secure Boot, flash encryption
Interface & Development Support

The module supports up to 20 GPIO interfaces that can be multiplexed for UART, SPI, I2C, ADC, PWM, SDIO, and USB functions, providing exceptional flexibility for diverse application requirements.

Development is supported through both the QuecOpen® solution and standard AT commands, utilizing a compact protocol design to accelerate product development and reduce time-to-market.

Application Areas

The FGM840R is designed for a wide range of IoT applications including smart home systems, industrial automation, consumer electronics, portable devices, and connected terminals. Its combination of wireless connectivity and embedded processing makes it ideal for creating intelligent products that require reliable communication and responsive operation.

Design Benefits

The compact LGA package helps optimize end-product size and manufacturing costs while ensuring compatibility with diverse design requirements. The integrated MCU architecture simplifies product development by combining computing resources and wireless connectivity into a single, efficient solution that enhances system performance while reducing development complexity.


Product Tags:

FGM840R Wi-Fi Bluetooth MCU module

      

Dual-Core Cortex-M33 M23 processor module

      

Quectel Wi-Fi 4 Bluetooth module

      
China FGM840R Wi-Fi 4 & Bluetooth MCU Module with Dual-Core Cortex-M33/M23 Processor | Quectel wholesale

FGM840R Wi-Fi 4 & Bluetooth MCU Module with Dual-Core Cortex-M33/M23 Processor | Quectel Images

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